Our Range

We offer specially formulated no-clean fluxes that meet below listed conditions, and are suitable for a variety of applications.

NoClean Flux

Soldering with no-clean flux is a viable alternative for eliminating the laborious post solder cleaning using costly and polluting CFC solvent cleaning.

Our Range

We offer specially formulated no-clean fluxes that meet below listed conditions, and are suitable for a variety of applications.

No-Clean Flux

To eliminate cleaning, the flux and soldering process must:

  • Bind effectively to make sound solder joints
  • Leave minimal amount of residue after soldering
  • Have left over residue which is translucent, aesthetically acceptable and non-tacky that will not interfere in any in-circuit testing, automated pin testing or bed-of-nails testing.
  • Have left over residue that will not react with the circuit or components and will stay inert and not be influenced by changes in temperature, humidity or fluctuations in voltage.
  • Be economic and practically feasible.

    No-Clean Fluxes are low solid (less than 5%) fluxes, specially developed for SMDs and mixed technology soldering. They are completely non-halide, show outstanding solderability on all types of board including SMDs, give excellent wetting on surface mounted components, and leave no visible flux residue after soldering. Often no further cleaning is required, but if very high ionic cleanliness is needed, the residue can be removed by solvent or saponification cleaning. No-clean fluxes with solid content less than 3% are also available for use in foam flux operations as well as application by dipping, brushing or spraying.



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Tel: +27 11 873 9000